Wiring Connector Manufacturers Briefly on Connector Gold Plating Indicators
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Author:EXCELTEK
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Published time: 2019-06-17
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Connectors are a component that our electronic engineering technicians often come into contact with. Its role is very simple: in the circuit is blocked or isolated between the circuit, set up a bridge of communication, so that the current flows, so that the circuit achieves the inte-nded function, the details determine the success or failure, the quality of the gold plating layer of the connector is seriously affected With the quality of the connector, recently, the AMP2.0wafer harness connector manufacturer gave us an analysis of the "key indicators of the quality of the gold-plated connector."
It is understood that in the Greater China region, there are few distributors and agents that can stand in the vast connector market for a long time, and the AMP2.0wafer harness connector manufacturers are one of the few. This turbulent industry, knowing the undercurrent of the connector market, can stand proudly in the "sand field." AMP2.0wafer harness connector manufacturers said that in recent years, China's communication field has developed rapidly, and many problems have been exposed in the mathematical communication and control circuit system. The main performance is: high bit error rate due to poor contact and the whole system Poor, the main cause of failure is the quality of the connector and the use of the environment, especially the quality of the gold layer is the biggest impact. In the current development of communication systems, connectors are becoming more widely used and more numerous. The electrical contact reliability of the connector directly affects the operation of the entire communication system, and the quality of the gold plating of the connector is one of the important parameters for evaluating the quality of the connector. At present, there are some quality problems in the gold plating layer of the domestically produced connectors, mainly in the following: uneven thickness of the gold plating layer, large number of micropores, low wear resistance and low corrosion resistance of the coating, and the gold plating layer of the connector produced at home and abroad. Comparing the test analysis, the quality of the gold-plated layer of the connector produced in China needs to be improved. AMP2.0wafer harness connector manufacturer analysis, the base material of the connector is copper alloy, the surface coating is gold and its alloy, because it is all inert metal, it is not corroded in various corrosive environments, and the resistivity is low, and The base material has good adhesion, protects the base material from corrosion, and protects the connector from good electrical properties. The disadvantage is that the price is expensive and the plating layer is thin, so the microporosity problem is more prominent. Pure gold has low hardness, easy to bond and wear, and uses gold alloy as coating to improve its hardness and wear resistance. In addition, the base metal copper is easily diffused by the gold plating layer on the surface. When the copper diffuses to the surface, it is oxidized in the air to form a copper oxide film, which causes electrical contact failure. To prevent this, nickel is plated between the base copper and the surface gold plating layer. In addition, due to the presence of micropores in the gold plating layer, nickel is exposed to the environment and reacts with sulfur dioxide (So2) in the atmosphere to form nickel sulfate (Niso4.XH2O). The product is insulated and the volume of the corroded metal is much larger. The micropores spread to the gold plating layer, causing contact failure. It can be seen that one of the key indicators for evaluating the quality of the gold plating layer is the microporosity of the gold plating layer (the number of micropores per square centimeter area), and the microporosity is closely related to the thickness of the plating layer, and the thicker the plating layer, the micropores The lower. If the plating is too thin and there are a large number of micropores, the base metal is exposed to the environment in a large area, the coating not only does not have the protective effect, but also because the potential difference between the gold and the base material (nickel or copper alloy) is very different. Large, thereby accelerating electrochemical corrosion, while the surface roughness of the substrate is closely related to the microporosity, and the lower the surface roughness, the lower the microporosity. The AMP2.0wafer harness connector manufacturer emphasizes that the plug-in life of the connector is determined by its wear resistance. If the gold plating is worn to expose it at the bottom, the substrate may be corroded and its product will cause electrical failure. So far, the connector has developed into a series of products with a wide range of products, rich variety specifications, diverse structural types, professional direction, industry characteristics, standard system specifications, how to evaluate the quality of the gold-plated layer of the connector Key metrics have become an important indicator for connector industry professionals to measure connector quality.
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